Candy Industry: Shemesh appoints Mike Lynch

Mike Lynch’s appointment as Shemesh Automation’s new Director for North America was the subject of this article published by Candy Industry. You can read the full piece  here.

Shemesh appoints Mike Lynch as director for North America

Lynch brings over 30 years of machinery, equipment expertise to role.

Shemesh Automation has appointed packaging machinery veteran Mike Lynch as director for the North American market.

Mike Lynch

In 2021, Shemesh responded to rapid growth in its U.S. customer base with the purchase of a 43,055-sq.-ft. flagship facility in Green Bay, Wisconsin. The site is intended to serve as the new headquarters for Shemesh USA, Inc.

Shemesh has further widened its U.S. footprint with the appointment of Lynch, who will be based out of Maryland.

Lynch brings over 30 years of machinery and equipment experience to his new role and will be familiar to Shemesh’s customers through his previous roles with Bauer, Multivac and Elsner Engineering Works.

“Mike’s knowledge and experience within our industry in North America is tremendous, and I am delighted to welcome Mike to the team,” said Shemesh’s President and CEO Shai Shemesh. “Having collaborated with Mike on many major projects in the past, I can say with complete certainty that our current and future customers will thoroughly enjoy working with Mike and will benefit hugely from Mike’s knowhow and expertise. Together, with our exceptional facility in Green Bay and our expert team of field engineers based in different locations across the U.S., Mike’s addition underlines our commitment to continue our impressive growth in the U.S. market and to supporting our valued customer base.”

“I look forward to expanding Shemesh’s already growing business in North America,” Lynch added. “Shemesh has been busy expanding its packaging automation offerings and developing strategic alliances to broaden its portfolio of capabilities. I’m excited about the opportunity to engage with customers looking for a full spectrum of packaging solutions from single machines to full turn-key integrated systems.”

You can read the original article, which was published on 26th September 2022 here